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  • Recognized by State Four-Ministry Council as one of the very 1st group of IC manufacturers in China.






QFN Quad Flat No- Lead Package 方形扁平式无引脚封装


Advantage:

         thinner / smaller      Low thermal resistance      Low Inductance


Applications:

         Excellent choice for many of the new generation devices, especially for mobile phones, WiFi, PDA’s and Bluetooth™  where size, weight and package performance is required.

COL-QFN Chip On Lead QFN Package:

         COL biggest advantage a larger die to be assembled in the same package


Package Portfolio 产品规格
 Package body size range:
 QFN (3x3mm2 to 8x8mm2)
 DFN (1.0x0.6mm 2  to 2x5mm 2 )
 Package profile thickness
 W – 0.75 +/- 0.05mm,  UT – max 0.6mm
 X1 – max 0.5mm,  X2 – max 0.4mm
 Lead finish (Plating):
 NiPdAu
 Matte pure tin


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