Features
- Plastic package has Underwriters Labora to ry Flammability Classification 94V-0
- For surface mounted applications
- Low profile package
- Built-in strain relief, ideal for au to mated placement
- Glass passivated chip junction
- High temperature soldering: 250℃/10 seconds at terminals
Mechanical data
- Case: JEDEC DO-214AC (SMA) molded plastic over glass passivated chip
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Weight: 0.002 ounce, 0.064 gram
Product Pictures
Product Attributes
| Case : | DO-214AC (SMA) |
| VRRM(V) : | 1000 |
| VRMS(V) : | 700 |
| VDC(V) : | 1000 |
| IFSM(A) : | 30.0(@TL=110℃) |
| VF(V) : | 1.10 |
| IR(uA) : | 5.0(@TA=25℃) 50(@TA=125℃) |
| CJ(pF) : | 12 |
| TJ(℃) : | -55 to +150 |
| TSTG(℃) : | -55 to +150 |
| IF(AV)(A) : | 1.0 |
| trr(uS) : | 1.0 |
| RθJA(℃/W) : | 85 |
| RθJL(℃/W) : | 30 |
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