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- The 1st QFN / DFN Packaging & Test service provider in China.
- Recognized by State Four-Ministry Council as one of the very 1st group of IC manufacturers in China.
QFN Quad Flat No- Lead Package 方形扁平式无引脚封装
thinner / smaller Low thermal resistance Low Inductance Excellent choice for many of the new generation devices, especially for mobile phones, WiFi, PDA’s and Bluetooth™ where size, weight and package performance is required. COL biggest advantage a larger die to be assembled in the same package Availability
Package Portfolio 产品规格
Package body size range: QFN (2.5 x 2.5mm2 to 8x8mm2) DFN (1.0 x 0.6mm 2 to 2x5mm2) COL (1.4 x 1.8mm / 1.7 x 1.3 / 3 x 1 mm2) Package profile thickness W – 0.75 +/- 0.05mm, UT – max 0.6mm X1 – max 0.5mm, X2 – max 0.4mm Lead finish (Plating): NiPdAu Matte pure tin 
